MICROSS COMPONENTS MYX4DD3K512M64PBG2-25ET | 搜芯易Sourcengine

MICROSS COMPONENTS MYX4DD3K512M64PBG2-25ET

生命周期状态
Active
REACH
REACH compliant
说明
DDR3 DRAM, 512MX72, CMOS, PBGA375
类别
Semiconductors Memory ICs DRAMs DDR3 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
19
Access Mode
MULTI BANK PAGE BURST
Length (mm)
21.5
JESD-30 Code
R-PBGA-B375
Memory Width
72
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; SEATED HT-CALCULATED
Memory Organization
512MX72
Number of Functions
1
Number of Terminals
375
Terminal Pitch (mm)
1
Number of Words Code
512M
Memory Density (bits)
38654705664
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.96
Number of Words (words)
536870912