MICROSS COMPONENTS MYX4DD3K256M64PBG2-25IT | 搜芯易Sourcengine

MICROSS COMPONENTS MYX4DD3K256M64PBG2-25IT

生命周期状态
Active-Unconfirmed
REACH
REACH compliant
说明
DDR3L DRAM, 256MX64, CMOS, PBGA375
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
19
Access Mode
MULTI BANK PAGE BURST
Length (mm)
21.5
JESD-30 Code
R-PBGA-B375
Memory Width
64
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
256MX64
Number of Functions
1
Number of Terminals
375
Terminal Pitch (mm)
1
Number of Words Code
256M
Memory Density (bits)
17179869184
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.96
Supply Voltage-Nom (V)
1.35
Number of Words (words)
268435456