Macronix International Co., Ltd. MX66L2G43GXRI08 | 搜芯易Sourcengine

Macronix International Co., Ltd. MX66L2G43GXRI08

生命周期状态
Active-Unconfirmed
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Flash, 256MX8, PBGA24
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
CMOS
Width (mm)
6
Length (mm)
8
JESD-30 Code
R-PBGA-B24
Memory Width
8
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
FLASH
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Serial Bus Type
QSPI
Write Protection
HARDWARE/SOFTWARE
Terminal Position
BOTTOM
Memory Organization
256MX8
Number of Functions
1
Number of Terminals
24
Terminal Pitch (mm)
1
Number of Words Code
256M
Memory Density (bits)
2147483648
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.3
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
2.7
Supply Voltage-Nom (V)
3
Data Retention Time-Min
20
Number of Words (words)
268435456
Programming Voltage (V)
3
Standby Current-Max (A)
8.0E-5
Supply Current-Max (mA)
100
Package Equivalence Code
BGA24,5X5,40
Clock Frequency-Max (MHz)
120
Endurance (Write/Erase Cycles)
100000
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40