Macronix International Co., Ltd. MX29GL256FUT2I-11G | 搜芯易Sourcengine

Macronix International Co., Ltd. MX29GL256FUT2I-11G

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
NOR Flash Parallel 3.3V 256M-bit 32M x 8/16M x 16 110ns 56-Pin TSOP-I
类别
Semiconductors Memory ICs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Ready/Busy
YES
Technology
CMOS
Toggle Bit
YES
Width (mm)
14.0000
Length (mm)
18.4000
Data Polling
YES
JESD-30 Code
R-PDSO-G56
Memory Width
16
Package Code
TSOP1
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Page Size (words)
8/16
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Memory Organization
16MX16
Number of Functions
1
Number of Terminals
56
Sector Size (words)
128K
Terminal Pitch (mm)
0.500
Access Time-Max (ns)
110.0000000000000000
Number of Words Code
16M
Memory Density (bits)
268435456.0000000000000000
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
8
Command User Interface
YES
Common Flash Interface
YES
Number of Sectors/Size
256
Seated Height-Max (mm)
1.2000
Supply Voltage-Max (V)
3.60000
Supply Voltage-Min (V)
2.70000
Supply Voltage-Nom (V)
3
Number of Words (words)
16777216.0000000000000000
Programming Voltage (V)
3
Standby Current-Max (A)
0.000010000000000
Supply Current-Max (mA)
30.000000000000000
Package Equivalence Code
TSSOP56,.8,20
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
85.0
Operating Temperature-Min (Cel)
-40.0
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED