Macronix International Co., Ltd. MX23L12824XI-12 | 搜芯易Sourcengine

Macronix International Co., Ltd. MX23L12824XI-12

生命周期状态
Discontinued
说明
MASK ROM, 256KX16, 200ns, CMOS, PBGA64
类别
Semiconductors Memory ICs MASK ROMs MASK ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-PBGA-B64
Memory Width
16
Organization
8MX16
Package Code
BGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
134217728 bit
Memory IC Type
MASK ROM
Terminal Pitch
1 mm
Access Time-Max
120 ns
Number of Words
8388608 words
Terminal Finish
Tin/Lead (Sn/Pb)
Temperature Grade
OTHER
Terminal Position
BOTTOM
Supply Current-Max
50 mA
Number of Terminals
64
Standby Current-Max
1.5E-5 Amp
Number of Words Code
8M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
8
Package Equivalence Code
BGA64,8X8,40
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-25 Cel