Microsemi Corporation MV8870-1DG | 搜芯易Sourcengine

Microsemi Corporation MV8870-1DG

生命周期状态
Discontinued
说明
DTMF Signaling Circuit, CMOS, CDIP18
类别
Semiconductors Telecom ICs Telecom Signaling Circuits DTMF SIGNALING CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
7.62
Length (mm)
25.4
JESD-30 Code
R-XDIP-T18
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
Telecom IC Type
DTMF SIGNALING CIRCUIT
DLA Qualification
Not Qualified
Temperature Grade
OTHER
Terminal Position
DUAL
Number of Functions
1
Number of Terminals
18
Terminal Pitch (mm)
2.54
Package Body Material
CERAMIC
Seated Height-Max (mm)
5.08
Supply Voltage-Nom (V)
5
Supply Current-Max (mA)
7
Package Equivalence Code
DIP18,.3
Operating Temperature-Max (Cel)
80
Operating Temperature-Min (Cel)
-40