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MT75L8L32MLQ-70

Micron Technology

Micron Technology MT75L8L32MLQ-70
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    14 mm
  • Length
    20 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    32
  • Organization
    8KX32
  • Package Code
    LQFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    262144 bit
  • Memory IC Type
    CONTENT ADDRESSABLE SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Number of Words
    8192 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1.6 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Supply Current-Max
    350 mA
  • Number of Functions
    1
  • Number of Terminals
    100
  • Standby Current-Max
    0.005 Amp
  • Number of Words Code
    8K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    QFP100,.63X.87
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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MT75L8L32MLQ-70
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MT75L8L32MLQ-70