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MT75L8L32MLQ-40IT

Micron Technology

Micron Technology MT75L8L32MLQ-40IT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    64
  • Organization
    8KX64
  • Package Code
    QFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    524288 bit
  • Memory IC Type
    CONTENT ADDRESSABLE SRAM
  • Terminal Pitch
    0.635 mm
  • Number of Words
    8192 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    600 mA
  • Number of Terminals
    100
  • Standby Current-Max
    0.005 Amp
  • Number of Words Code
    8K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    QFP100,.63X.87
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    3.3 V

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MT75L8L32MLQ-40IT
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