Micron Technology MT49H8M32HU-33 | 搜芯易Sourcengine

Micron Technology MT49H8M32HU-33

生命周期状态
Discontinued
说明
DDR DRAM, 8MX32, CMOS, PBGA144
类别
Semiconductors Memory ICs DRAMs DDR DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.24
SB Code
8542.32.00.15

Width
11 mm
Length
18.5 mm
I/O Type
COMMON
Technology
CMOS
Access Mode
MULTI BANK PAGE BURST
JESD-30 Code
R-PBGA-B144
Memory Width
32
Organization
8MX32
Package Code
TBGA
JESD-609 Code
e0
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
268435456 bit
Memory IC Type
DDR DRAM
Operating Mode
SYNCHRONOUS
Terminal Pitch
1 mm
Number of Ports
1
Number of Words
8388608 words
Terminal Finish
TIN LEAD SILVER
Seated Height-Max
1.2 mm
Temperature Grade
OTHER
Terminal Position
BOTTOM
Additional Feature
AUTO REFRESH
Supply Current-Max
807 mA
Number of Functions
1
Number of Terminals
144
Number of Words Code
8M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Sequential Burst Length
2,4
Package Equivalence Code
BGA144,12X18,40/32
Operating Temperature-Max
95 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Clock Frequency-Max (fCLK)
300 MHz