Micron Technology MT49H32M18CFM-33 | 搜芯易Sourcengine

Micron Technology MT49H32M18CFM-33

生命周期状态
Discontinued
说明
DDR DRAM, 32MX18, 0.25ns, CMOS, PBGA144
类别
Semiconductors Memory ICs DRAMs DDR DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.32
SB Code
8542.32.00.15

I/O Type
SEPARATE
Technology
CMOS
JESD-30 Code
R-PBGA-B144
Memory Width
18
Organization
32MX18
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
603979776 bit
Memory IC Type
DDR DRAM
Terminal Pitch
0.8 mm
Access Time-Max
0.25 ns
Number of Words
33554432 words
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Supply Current-Max
819 mA
Number of Terminals
144
Standby Current-Max
0.048 Amp
Number of Words Code
32M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Sequential Burst Length
2,4,8
Interleaved Burst Length
2,4,8
Package Equivalence Code
BGA144,12X18,40/32
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Clock Frequency-Max (fCLK)
300 MHz