Micron Technology MT29F128G08AKCABH2-10 | 搜芯易Sourcengine

Micron Technology MT29F128G08AKCABH2-10

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Flash, 16GX8, 20ns, PBGA100
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
SLC NAND TYPE
Ready/Busy
YES
Technology
CMOS
Toggle Bit
YES
Width (mm)
12
Length (mm)
18
JESD-30 Code
R-PBGA-B100
Memory Width
8
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS/SYNCHRONOUS
Parallel/Serial
PARALLEL
Page Size (words)
8K
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
SEATED HGT_CALCULATED
Memory Organization
16GX8
Number of Functions
1
Number of Terminals
100
Sector Size (words)
1M
Terminal Pitch (mm)
1
Access Time-Max (ns)
20
Number of Words Code
16G
Memory Density (bits)
137438953472
Package Body Material
PLASTIC/EPOXY
Number of Sectors/Size
16K
Seated Height-Max (mm)
1.45
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
2.7
Supply Voltage-Nom (V)
3.3
Number of Words (words)
17179869184
Programming Voltage (V)
3.3
Standby Current-Max (A)
5.0E-5
Supply Current-Max (mA)
50
Package Equivalence Code
BGA100,10X17,40
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED