LAPIS Semiconductor Co., Ltd. MSM5718B70-53GS-K | 搜芯易Sourcengine

LAPIS Semiconductor Co., Ltd. MSM5718B70-53GS-K

生命周期状态
Discontinued
说明
Rambus DRAM, 2MX9, CMOS, PDSO72
类别
Semiconductors Memory ICs DRAMs RAMBUS DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.02
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PDSO-G72
Memory Width
9
Organization
2MX9
Package Code
SSOP
JESD-609 Code
e0
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
18874368 bit
Memory IC Type
RAMBUS DRAM
Refresh Cycles
1024
Terminal Pitch
0.635 mm
Number of Words
2097152 words
Terminal Finish
Tin/Lead (Sn/Pb)
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Number of Terminals
72
Number of Words Code
2M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
SSOP72,.5
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
3.3 V
Clock Frequency-Max (fCLK)
266 MHz