LAPIS Semiconductor Co., Ltd. MR26V01G54R-XXXMB | 搜芯易Sourcengine

LAPIS Semiconductor Co., Ltd. MR26V01G54R-XXXMB

生命周期状态
Transferred
说明
MASK ROM, 32MX32, 105ns, PDSO70
类别
Semiconductors Memory ICs MASK ROMs MASK ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

JESD-30 Code
R-PDSO-G70
Memory Width
32
Package Code
SSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
MASK ROM
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Memory Organization
32MX32
Number of Terminals
70
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
105
Number of Words Code
32M
Memory Density (bits)
1073741824
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
16
Supply Voltage-Nom (V)
3.3
Number of Words (words)
33554432
Standby Current-Max (A)
0.025
Supply Current-Max (mA)
100
Package Equivalence Code
SOP70,.63,32
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0