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MR18R0824BM0-CK8

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. MR18R0824BM0-CK8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    BLOCK ORIENTED PROTOCOL
  • JESD-30 Code
    R-XDMA-N184
  • Memory Width
    18
  • Organization
    32MX18
  • Package Code
    DIMM
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    603979776 bit
  • Memory IC Type
    RAMBUS DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    45 ns
  • Number of Ports
    1
  • Number of Words
    33554432 words
  • Terminal Position
    DUAL
  • Additional Feature
    SELF CONTAINED REFRESH
  • Number of Functions
    1
  • Number of Terminals
    184
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIMM184,40
  • Supply Voltage-Max (Vsup)
    2.63 V
  • Supply Voltage-Min (Vsup)
    2.37 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Clock Frequency-Max (fCLK)
    800 MHz

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