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MPC859DSLZP66

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MPC859DSLZP66
  • ECCN
    5A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Speed
    66 rpm
  • Width
    25 mm
  • Format
    FIXED POINT
  • Length
    25 mm
  • Bit Size
    32
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B357
  • Package Code
    BGA
  • Boundary Scan
    YES
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1.27 mm
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • Seated Height-Max
    2.52 mm
  • Terminal Position
    BOTTOM
  • Additional Feature
    REQUIRES 3.3V I/O SUPPLY
  • Supply Voltage-Max
    1.9 V
  • Supply Voltage-Min
    1.7 V
  • Supply Voltage-Nom
    1.8 V
  • Clock Frequency-Max
    66 MHz
  • Number of Terminals
    357
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    32
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    220
  • Time@Peak Reflow Temperature-Max (s)
    30

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MPC859DSLZP66