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MPC8555EPXAKE

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MPC8555EPXAKE
  • ECCN
    5A002
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Speed
    600 rpm
  • Width
    29 mm
  • Format
    FIXED POINT
  • Length
    29 mm
  • Bit Size
    32
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B783
  • Package Code
    BGA
  • Boundary Scan
    YES
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1 mm
  • Terminal Finish
    Tin/Lead/Silver (Sn/Pb/Ag)
  • Integrated Cache
    YES
  • Address Bus Width
    15
  • Seated Height-Max
    3.75 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    1.26 V
  • Supply Voltage-Min
    1.14 V
  • Supply Voltage-Nom
    1.2 V
  • Number of Terminals
    783
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA783,28X28,40
  • Operating Temperature-Max
    105 Cel
  • Operating Temperature-Min
    0 Cel
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    245
  • Time@Peak Reflow Temperature-Max (s)
    30

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