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MPC562MZP66R2

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MPC562MZP66R2
  • ECCN
    3A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Speed
    66 rpm
  • Width
    27 mm
  • Length
    27 mm
  • Bit Size
    32
  • Technology
    CMOS
  • RAM (bytes)
    32768
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    S-PBGA-B388
  • PWM Channels
    NO
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    1 mm
  • Terminal Finish
    Tin/Lead/Silver (Sn62Pb36Ag2)
  • Address Bus Width
    24
  • Seated Height-Max
    2.55 mm
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    2.7 V
  • Supply Voltage-Min
    2.5 V
  • Supply Voltage-Nom
    2.6 V
  • Clock Frequency-Max
    20 MHz
  • Number of I/O Lines
    16
  • Number of Terminals
    388
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA388,26X26,40
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -40 Cel
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peak Reflow Temperature (Cel)
    240
  • Time@Peak Reflow Temperature-Max (s)
    30

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MPC562MZP66R2
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MPC562MZP66R2