MPE-Garry GmbH MP08.3SGGBU | 搜芯易Sourcengine

MPE-Garry GmbH MP08.3SGGBU

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
J-STD-609 Code
e4
Mounting Style
STRAIGHT
Housing Material
PLASTIC
Termination Type
SOLDER
Additional Feature
UL 94V-0
Body Length (inch)
0.397
Current Rating (A)
1
Device Socket Type
IC SOCKET
Number of Contacts
18
Body Breadth (inch)
0.397
Device Type Used On
DIP18
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
2.54
Contact Finish - Mating
GOLD
Socket Body Depth (inch)
0.161
Mating Contact Pitch (inch)
0.1
Contact Finish - Termination
Gold (Au)
PCB Contact Row Spacing (mm)
7.62
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Dielectric Withstanding Voltage (V)
1000VAC