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ML66525B-XXLA

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. ML66525B-XXLA
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.20
  • Bit Size
    16
  • CPU Family
    OLMS-66K
  • Technology
    CMOS
  • Width (mm)
    11
  • Length (mm)
    11
  • Speed (MHz)
    24
  • ADC Channels
    YES
  • DAC Channels
    NO
  • DMA Channels
    YES
  • JESD-30 Code
    S-PBGA-B144
  • PWM Channels
    YES
  • Package Code
    LFBGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    20
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    71
  • Number of Terminals
    144
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    0.8
  • Data RAM Size (bytes)
    6144
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.5
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    60
  • Package Equivalence Code
    BGA144,13X13,32
  • Clock Frequency-Max (MHz)
    24
  • Program Memory Size (words)
    131072
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -30

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ML66525B-XXLA
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ML66525B-XXLA