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ML63187-XXXGA

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. ML63187-XXXGA
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Bit Size
    4
  • CPU Family
    OLMS-63K
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • Speed (MHz)
    2
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-PQFP-G128
  • PWM Channels
    NO
  • Package Code
    FQFP
  • Boundary Scan
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Number of I/O Lines
    8
  • Number of Terminals
    128
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    0.5
  • Data RAM Size (bytes)
    512
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.35
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    1
  • Package Equivalence Code
    QFP128,.63X.87,20
  • Clock Frequency-Max (MHz)
    2
  • Program Memory Size (words)
    16384
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -20

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ML63187-XXXGA
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ML63187-XXXGA