LAPIS Semiconductor Co., Ltd. ML22765-XXXMB | 搜芯易Sourcengine

LAPIS Semiconductor Co., Ltd. ML22765-XXXMB

生命周期状态
Transferred
说明
OTP ROM, 16MX1, CMOS, PDSO30
类别
Semiconductors Memory ICs OTP ROMs OTP ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
5.6
Length (mm)
9.7
JESD-30 Code
R-PDSO-G30
Memory Width
1
Package Code
SSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
OTP ROM
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Additional Feature
IT ALSO OPERATES AT 4.5 TO 5.5 V NOMINAL SUPPLY VOLTAGE
Memory Organization
16MX1
Number of Functions
1
Number of Terminals
30
Terminal Pitch (mm)
0.65
Number of Words Code
16M
Memory Density (bits)
16777216
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.85
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
2.7
Supply Voltage-Nom (V)
5
Number of Words (words)
16777216
Clock Frequency-Max (MHz)
0.4
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40