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MH8S72ABGA-6

Mitsubishi Electric Corp.

Mitsubishi Electric Corp. MH8S72ABGA-6
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    18 mm
  • Length
    32 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    DUAL BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B124
  • Memory Width
    72
  • Organization
    8MX72
  • Package Code
    BGA
  • Self Refresh
    YES
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    603979776 bit
  • Memory IC Type
    SYNCHRONOUS DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    4096
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    5.4 ns
  • Number of Ports
    1
  • Number of Words
    8388608 words
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    5.8 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Supply Current-Max
    800 mA
  • Number of Functions
    1
  • Number of Terminals
    124
  • Standby Current-Max
    0.005 Amp
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA124,12X22,50
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    133 MHz

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MH8S72ABGA-6
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MH8S72ABGA-6