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MH32D36ABGA-75

Mitsubishi Electric Corp.

Mitsubishi Electric Corp. MH32D36ABGA-75
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    18 mm
  • Length
    32 mm
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B84
  • Memory Width
    36
  • Organization
    32MX36
  • Package Code
    BGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1207959552 bit
  • Memory IC Type
    DDR DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    0.75 ns
  • Number of Ports
    1
  • Number of Words
    33554432 words
  • Seated Height-Max
    5.8 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    84
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    2.7 V
  • Supply Voltage-Min (Vsup)
    2.3 V
  • Supply Voltage-Nom (Vsup)
    2.5 V

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MH32D36ABGA-75