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MGCM02/KG/BP1Q

ZARLINK SEMICONDUCTOR INC

ZARLINK SEMICONDUCTOR INC MGCM02/KG/BP1Q
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    7
  • Length (mm)
    7
  • JESD-30 Code
    S-PBGA-B49
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Telecom IC Type
    BASEBAND CIRCUIT
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    49
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.5
  • Supply Voltage-Nom (V)
    3
  • Supply Current-Max (mA)
    0.026
  • Package Equivalence Code
    BGA49,7X7,32
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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MGCM02/KG/BP1Q
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MGCM02/KG/BP1Q