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MCM63R818RS3.7

Motorola,Inc.

Motorola,Inc. MCM63R818RS3.7
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    X-CBGA-B119
  • Memory Width
    18
  • Package Code
    BGA
  • Package Shape
    UNSPECIFIED
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    LATE-WRITE SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    256KX18
  • Number of Functions
    1
  • Number of Terminals
    119
  • Access Time-Max (ns)
    1.85
  • Number of Words Code
    256K
  • Memory Density (bits)
    4718592
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.375
  • Number of Words (words)
    262144
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MCM63R818RS3.7