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MC74F2970J

Motorola,Inc.

Motorola,Inc. MC74F2970J
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    7.62
  • Length (mm)
    32.07
  • JESD-30 Code
    R-GDIP-T24
  • Package Code
    DIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Number of Banks
    1
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Seated Height-Max (mm)
    4.44
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    125
  • Package Equivalence Code
    DIP24,.3
  • uPs/uCs/Peripheral ICs Type
    MEMORY CONTROLLER, DRAM
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MC74F2970J