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MB9BF112NBGL

Fujitsu Limited

Fujitsu Limited MB9BF112NBGL
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • CPU Family
    CORTEX-M3
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • Speed (MHz)
    144
  • ADC Channels
    YES
  • DAC Channels
    NO
  • DMA Channels
    YES
  • JESD-30 Code
    S-PBGA-B112
  • PWM Channels
    YES
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    25
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    83
  • Number of Terminals
    112
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.8
  • Data RAM Size (bytes)
    16384
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.45
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    4.5
  • External Data Bus Width
    16
  • Package Equivalence Code
    BGA112,11X11,32
  • Clock Frequency-Max (MHz)
    48
  • Program Memory Size (words)
    163840
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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MB9BF112NBGL
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MB9BF112NBGL