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MB81C1501PF

Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. MB81C1501PF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • Width
    14 mm
  • Length
    20.2 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G38
  • Memory Width
    1
  • Organization
    1MX1
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    1048576 bit
  • Memory IC Type
    VIDEO DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    25 ns
  • Number of Ports
    3
  • Number of Words
    1048576 words
  • Seated Height-Max
    3.35 mm
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    38
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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MB81C1501PF
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MB81C1501PF