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M6MGB64BS8BWG

Renesas Technology Corp.

Renesas Technology Corp. M6MGB64BS8BWG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    8.5 mm
  • Length
    10.8 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B67
  • Memory Width
    16
  • Organization
    4MX16
  • Package Code
    FBGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    67108864 bit
  • Memory IC Type
    MEMORY CIRCUIT
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Words
    4194304 words
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    SRAM IS ORGANIZED AS 512K X 16
  • Number of Functions
    1
  • Number of Terminals
    67
  • Number of Words Code
    4M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    20

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M6MGB64BS8BWG
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M6MGB64BS8BWG