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M66200AFP

Mitsubishi Electric Corp.

M66200AFP 产品规格书
Mitsubishi Electric Corp. M66200AFP
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    5.3
  • Length (mm)
    15.02
  • JESD-30 Code
    R-PDSO-G24
  • Package Code
    SOP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Number of Banks
    2
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1M X 1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.1
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    0
  • Package Equivalence Code
    SOP24,.3
  • uPs/uCs/Peripheral ICs Type
    MEMORY CONTROLLER, DRAM
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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M66200AFP