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M58BW016DB7ZA3FF

Micron Technology

Micron Technology M58BW016DB7ZA3FF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    10 mm
  • Length
    12 mm
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Sector Size
    2K,16K Words
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B80
  • Memory Width
    32
  • Organization
    512KX32
  • Package Code
    LBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    16777216 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    70 ns
  • Number of Words
    524288 words
  • Parallel/Serial
    PARALLEL
  • Screening Level
    AEC-Q100
  • Seated Height-Max
    1.6 mm
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    30 mA
  • Number of Functions
    1
  • Number of Terminals
    80
  • Programming Voltage
    3 V
  • Standby Current-Max
    5.0E-6 Amp
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    8,31
  • Package Equivalence Code
    BGA80,8X10,40
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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M58BW016DB7ZA3FF
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M58BW016DB7ZA3FF