Samsung Semiconductor, Inc. M393B2K70CM0-CF8 | 搜芯易Sourcengine

Samsung Semiconductor, Inc. M393B2K70CM0-CF8

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
DRAM Module, 2GX72, 0.3ns, CMOS
类别
Semiconductors Memory ICs DRAMs DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
30
Access Mode
FOUR BANK PAGE BURST
Length (mm)
133.35
JESD-30 Code
R-XDMA-N240
Memory Width
72
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory IC Type
DRAM MODULE
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
OTHER
Terminal Position
DUAL
Additional Feature
AUTO/SELF REFRESH
Memory Organization
2GX72
Number of Functions
1
Number of Terminals
240
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.3
Number of Words Code
2G
Memory Density (bits)
154618822656
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Seated Height-Max (mm)
4
Supply Voltage-Max (V)
1.575
Supply Voltage-Min (V)
1.425
Supply Voltage-Nom (V)
1.5
Number of Words (words)
2147483648
Standby Current-Max (A)
1.89
Supply Current-Max (mA)
5814
Package Equivalence Code
DIMM240,40
Clock Frequency-Max (MHz)
533
Moisture Sensitivity Level
2
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0