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M38510/20602BVX

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) M38510/20602BVX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • I/O Type
    COMMON
  • Technology
    BIPOLAR
  • Width (mm)
    10.16
  • Length (mm)
    9.65
  • JESD-30 Code
    R-CDIP-T18
  • Memory Width
    4
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Terminal Position
    DUAL
  • Memory Organization
    1KX4
  • Number of Functions
    1
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    85
  • Number of Words Code
    1K
  • Memory Density (bits)
    4096
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    2.16
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1024
  • Programming Voltage (V)
    5
  • Supply Current-Max (mA)
    140
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-M-38510 Class B

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M38510/20602BVX
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M38510/20602BVX