M25PX32SVZM3EB

Micron Technology

Micron Technology M25PX32SVZM3EB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    6 mm
  • Length
    8 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B24
  • Memory Width
    8
  • Organization
    4MX8
  • Package Code
    TBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    33554432 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Number of Words
    4194304 words
  • Parallel/Serial
    SERIAL
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    24
  • Programming Voltage
    2.7 V
  • Number of Words Code
    4M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3 V
  • Clock Frequency-Max (fCLK)
    75 MHz

M25PX32SVZM3EB有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
M25PX32SVZM3EB
提交询价
M25PX32SVZM3EB