LP621024DX-70LLTF

AMIC TECHNOLOGY CORP

AMIC TECHNOLOGY CORP LP621024DX-70LLTF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    8
  • Length (mm)
    11.8
  • JESD-30 Code
    R-PDSO-G32
  • Memory Width
    8
  • Package Code
    LSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    OTHER SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    70
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.25
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    2.0E-5
  • Standby Voltage-Min (V)
    2
  • Supply Current-Max (mA)
    70
  • Package Equivalence Code
    TSSOP32,.56,20
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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