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LMV243BL

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMV243BL
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    1.514
  • Length (mm)
    1.514
  • JESD-30 Code
    S-PBGA-B8
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.095
  • Supply Voltage-Nom (V)
    2.8
  • Supply Current-Max (mA)
    0.0125
  • Package Equivalence Code
    BGA8,3X3,20
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMV243BL
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LMV243BL