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LMP2015MFX

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMP2015MFX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Width
    1.6 mm
  • Length
    2.92 mm
  • Low-Bias
    YES
  • Wideband
    NO
  • Low-Offset
    YES
  • Micropower
    NO
  • Technology
    CMOS
  • Architecture
    VOLTAGE-FEEDBACK
  • JESD-30 Code
    R-PDSO-G5
  • Package Code
    SSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Slew Rate-Nom
    4 V/us
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Packing Method
    TAPE AND REEL
  • Terminal Pitch
    0.953 mm
  • Terminal Finish
    TIN LEAD
  • Voltage Gain-Min
    17780
  • Seated Height-Max
    1.22 mm
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Unity Gain BW-Nom
    3000 kHz
  • Programmable Power
    NO
  • Supply Current-Max
    1.5 mA
  • Number of Functions
    1
  • Number of Terminals
    5
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Input Offset Voltage-Max
    10 uV
  • Package Equivalence Code
    TSOP5/6,.11,37
  • Supply Voltage Limit-Max
    5.8 V
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Moisture Sensitivity Level
    1
  • Common-mode Reject Ratio-Nom
    130 dB
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMP2015MFX