NATIONAL SEMICONDUCTOR CORP LM8323JGR8AXM/NOPB | 搜芯易Sourcengine

NATIONAL SEMICONDUCTOR CORP LM8323JGR8AXM/NOPB

生命周期状态
Active
REACH
REACH compliant
说明
Mobile I/O Companion Supporting Key Scan 36-Pin CSBGA T/R
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

JESD-30 Code
S-PBGA-B36
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
36
Terminal Pitch (mm)
0.5
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Nom (V)
1.8
Supply Current-Max (mA)
3
Package Equivalence Code
BGA36,6X6,20
Moisture Sensitivity Level
1
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
40