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LM614BIN

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LM614BIN
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Width
    7.62 mm
  • Length
    21.755 mm
  • Low-Offset
    NO
  • Technology
    BIPOLAR
  • Architecture
    VOLTAGE-FEEDBACK
  • JESD-30 Code
    R-PDIP-T16
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Slew Rate-Min
    0.45 V/us
  • Slew Rate-Nom
    0.65 V/us
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Terminal Pitch
    2.54 mm
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Voltage Gain-Min
    40000
  • Seated Height-Max
    5.08 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Unity Gain BW-Nom
    520 kHz
  • Supply Current-Max
    1.07 mA
  • Number of Functions
    4
  • Number of Terminals
    16
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Input Offset Voltage-Max
    7000 uV
  • Package Equivalence Code
    DIP16,.3
  • Supply Voltage Limit-Max
    36 V
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Bias Current-Max (IIB) @25C
    0.035 uA
  • Common-mode Reject Ratio-Nom
    90 dB
  • Average Bias Current-Max (IIB)
    0.04 uA

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LM614BIN
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LM614BIN