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LF2272GM25

LOGIC DEVICES INC

LF2272GM25 产品规格书
LOGIC DEVICES INC LF2272GM25
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    33.4899
  • Length (mm)
    33.4899
  • JESD-30 Code
    S-CPGA-P120
  • Package Code
    PGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INPUT BUSES; 3 X 12 BIT DATA OUTPUT BUS
  • Number of Terminals
    120
  • Terminal Pitch (mm)
    2.54
  • Output Data Bus Width
    12
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    4.4196
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    12
  • Supply Current-Max (mA)
    160
  • Clock Frequency-Max (MHz)
    40
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, VIDEO IMAGING
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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