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LE25LA642CS

ONSEMI

ONSEMI LE25LA642CS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Memory Width
    8
  • Package Code
    BGA
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    EEPROM
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    8KX8
  • Number of Terminals
    8
  • Number of Words Code
    8K
  • Memory Density (bits)
    65536
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    20
  • Number of Words (words)
    8192
  • Standby Current-Max (A)
    2.0E-6
  • Supply Current-Max (mA)
    3
  • Package Equivalence Code
    BGA8,2X4(UNSPEC)
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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LE25LA642CS
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LE25LA642CS