LOGIC DEVICES INC L9D110G64BG4I10 | 搜芯易Sourcengine

LOGIC DEVICES INC L9D110G64BG4I10

生命周期状态
Discontinued
REACH
REACH compliant
说明
DDR DRAM Module, 16MX64, 0.8ns, CMOS, PBGA219
类别
Semiconductors Memory ICs DRAMs DDR DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.32
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B219
Memory Width
64
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR DRAM MODULE
Refresh Cycles
8192
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Memory Organization
16MX64
Number of Terminals
219
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
0.8
Number of Words Code
16M
Memory Density (bits)
1073741824
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Supply Voltage-Nom (V)
2.5
Number of Words (words)
16777216
Standby Current-Max (A)
0.022
Supply Current-Max (mA)
1450
Package Equivalence Code
BGA219,16X16,50
Clock Frequency-Max (MHz)
100
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40