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KM48RC2H-A66

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KM48RC2H-A66
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • Length
    25.1 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    BLOCK ORIENTED PROTOCOL
  • JESD-30 Code
    R-PDSO-G36
  • Memory Width
    8
  • Organization
    2MX8
  • Package Code
    LSSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    16777216 bit
  • Memory IC Type
    RAMBUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Number of Ports
    1
  • Number of Words
    2097152 words
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1.7 mm
  • Terminal Position
    DUAL
  • Supply Current-Max
    500 mA
  • Number of Functions
    1
  • Number of Terminals
    36
  • Standby Current-Max
    0.001 Amp
  • Number of Words Code
    2M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    SSOP72,.5
  • Supply Voltage-Max (Vsup)
    3.45 V
  • Supply Voltage-Min (Vsup)
    3.15 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    667 MHz

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KM48RC2H-A66
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KM48RC2H-A66