Samsung Semiconductor, Inc. KM2364SP-20 | 搜芯易Sourcengine

Samsung Semiconductor, Inc. KM2364SP-20

生命周期状态
Discontinued
说明
MASK ROM, 8KX8, 200ns, MOS, PDIP24
类别
Semiconductors Memory ICs MASK ROMs MASK ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
MOS
JESD-30 Code
R-PDIP-T24
Memory Width
8
Organization
8KX8
Package Code
DIP
JESD-609 Code
e0
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
Memory Density
65536 bit
Memory IC Type
MASK ROM
Terminal Pitch
2.54 mm
Access Time-Max
200 ns
Number of Words
8192 words
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Supply Current-Max
60 mA
Number of Terminals
24
Number of Words Code
8K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
DIP24,.6
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
5 V
Moisture Sensitivity Level
3