Samsung Semiconductor, Inc. KLMBG8FE3B-A001 | 搜芯易Sourcengine

Samsung Semiconductor, Inc. KLMBG8FE3B-A001

生命周期状态
Active-Unconfirmed
REACH
REACH compliant
说明
Flash Card, 32GX8, PBGA169
类别
Semiconductors Memory ICs Flash Memories FLASH CARD

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Width
12 mm
Length
16 mm
Technology
CMOS
JESD-30 Code
R-PBGA-B169
Memory Width
8
Organization
32GX8
Package Code
TFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
274877906944 bit
Memory IC Type
FLASH CARD
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.5 mm
Number of Words
34359738368 words
Parallel/Serial
PARALLEL
Seated Height-Max
1.2 mm
Temperature Grade
OTHER
Terminal Position
BOTTOM
Additional Feature
1.8V NOMINAL SUPPLY IS ALSO AVAILABLE
Number of Functions
1
Number of Terminals
169
Programming Voltage
3.3 V
Number of Words Code
32G
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-25 Cel
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
Clock Frequency-Max (fCLK)
52 MHz