Samsung Semiconductor, Inc. KFG5616D1A-DEB60 | 搜芯易Sourcengine

Samsung Semiconductor, Inc. KFG5616D1A-DEB60

生命周期状态
Discontinued
REACH
REACH compliant
说明
Flash, 16MX16, 76ns, PBGA67
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Width
7 mm
Length
9 mm
Technology
CMOS
JESD-30 Code
R-PBGA-B67
Memory Width
16
Organization
16MX16
Package Code
VFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
268435456 bit
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.8 mm
Access Time-Max
76 ns
Number of Words
16777216 words
Parallel/Serial
PARALLEL
Seated Height-Max
1 mm
Temperature Grade
OTHER
Terminal Position
BOTTOM
Additional Feature
SYNCHRONOUS BURST OPERATION IS POSSIBLE
Number of Functions
1
Number of Terminals
67
Programming Voltage
2.7 V
Number of Words Code
16M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-30 Cel
Supply Voltage-Max (Vsup)
2.9 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.65 V