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K9F5616U0C-HIB0

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K9F5616U0C-HIB0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Page Size
    256 words
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Sector Size
    8K Words
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B63
  • Memory Width
    16
  • Organization
    16MX16
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    268435456 bit
  • Memory IC Type
    FLASH
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    30 ns
  • Number of Words
    16777216 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    25 mA
  • Number of Terminals
    63
  • Standby Current-Max
    5.0E-5 Amp
  • Number of Words Code
    16M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    2K
  • Package Equivalence Code
    BGA63,10X12,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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