产品制造商
提交询价BOM 工具

K9F1216D0A-HIB00

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K9F1216D0A-HIB00
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    8.5 mm
  • Length
    15 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B63
  • Memory Width
    16
  • Organization
    32MX16
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    536870912 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    30 ns
  • Number of Words
    33554432 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    CONTAINS ADDITIONAL 16M BIT NAND FLASH
  • Number of Functions
    1
  • Number of Terminals
    63
  • Programming Voltage
    2.7 V
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    2.9 V
  • Supply Voltage-Min (Vsup)
    2.4 V
  • Supply Voltage-Nom (Vsup)
    2.65 V
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

K9F1216D0A-HIB00有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
K9F1216D0A-HIB00
提交询价
K9F1216D0A-HIB00