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K8P2815UQC-JE4BT

Samsung Semiconductor, Inc.

K8P2815UQC-JE4BT 产品规格书
Samsung Semiconductor, Inc. K8P2815UQC-JE4BT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM/TOP
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    S-PBGA-B64
  • Memory Width
    16
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e3
  • Memory IC Type
    FLASH
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    8
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Memory Organization
    8MX16
  • Number of Terminals
    64
  • Sector Size (words)
    4K,32K
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    65
  • Number of Words Code
    8M
  • Memory Density (bits)
    134217728
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    16,254
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    2.7
  • Standby Current-Max (A)
    3.0E-5
  • Supply Current-Max (mA)
    55
  • Package Equivalence Code
    BGA64,8X8,40
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

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