Samsung Semiconductor, Inc. K4C89093AF-ACFB | 搜芯易Sourcengine

Samsung Semiconductor, Inc. K4C89093AF-ACFB

生命周期状态
Active-Unconfirmed
REACH
REACH compliant
说明
DDR1 DRAM, 32MX9, 0.5ns, CMOS, PBGA60
类别
Semiconductors Memory ICs DRAMs DDR1 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.28
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PBGA-B60
Memory Width
9
Organization
32MX9
Package Code
BGA
JESD-609 Code
e0
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
301989888 bit
Memory IC Type
DDR1 DRAM
Terminal Pitch
1 mm
Access Time-Max
0.5 ns
Number of Words
33554432 words
Terminal Finish
Tin/Lead (Sn/Pb)
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Number of Terminals
60
Number of Words Code
32M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Sequential Burst Length
2,4
Interleaved Burst Length
2,4
Package Equivalence Code
BGA60,6X15,40
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Clock Frequency-Max (fCLK)
300 MHz